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| President, |
Jimmy Lai
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| Education | 1988 BSEE, National Taiwan University of Science and Technology
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| Experience | 2009 President, Semiconductor & OE Division, Hauman Technologies Corp., Taiwan 1990-2003 Manager/Director/Vice President, Semiconductor Division, Hauman Technologies Corp., Taiwan 1988-1990 IC Design Engineer, Winbond Corp., Taiwan |
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